הנדסה ו-R&D

Mechanical Designer of electronic packaging

115898

תאריך עדכון

16/09/2019

תיאור המשרה


Job description

Mechanical Design of electronic packaging including: military/rugged boards, enclosures; metal parts (mainly machining), and PCBs.

Thermal management of electronic boards and enclosures.

Production and assembly drawings of electronic assemblies.



Job qualifications and requirements

Proficient in CAD drafting: 3D (advantage: Inventor) and 2D (advantage: AutoCAD).
Personal Computer skills in Microsoft office {Word; Excel; Power-point; Outlook}
Knowledge of thermal analysis and thermal testing.
5 years Experience with mechanical design of electronic packaging and drafting.
Good skills in 3D design/modeling and in electronic/ mechanical integration/assembly.
High level of English reading and writing.
Good understanding of thermal management in electronic equipment.

Advantage: experience with VPX, VME, cPCI and military standards

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